512X Digital Die Protection & Process Monitor

Features

• Each channel can be programmed for use with NPN or PNP sensors
• Operates at press speeds up to 2000 spm
• Fast inputs able to catch events down to one millisecond
• Ten standard die protection channel logic types, plus custom types
• Each channel has its own channel logic timing window
• Channels can be configured to top stop, immediate stop, or intelli-stop
• Handles difficult situations found in the stamping environment (stuck slugs, bouncing strips, etc.)
• Channel logic for multiple-part-out situations
• Integrated gagging functionality allows easy use with lamination dies or other dies with sequencing requirements
• Supports part tracking, enabling complex applications such as automatic bad part detection and rejection
• Flexible bypassing options under supervisory control to reduce operator error and system down time
• Integrates with the system event log to report detailed information on die protection stops
• Real-time diagnostics include sensor status, voltage, in-window transitions, and more
• Real-time graphical display supports “overlaying” multiple strokes, so variations between strokes can be seen
• Supports complex servo motions when used with the 5100-amc-servo
• Each module acts as its own sensor interface connection box, and can be mounted in any convenient location for die hookups
• Front panel connection for up to eight sensors
• Internal wire terminals for up to 16 hardwired sensors
• Sensor interface provides 24 vdc @ 1 amp total
• Supports optional Link or customer-supplied quick-connect receptacle